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DATA SHEET
PD16873/A/B/C
MONOLITHIC 3-ASPECT SPINDLE MOTOR DRIVER
MOS Integrated Circuit
DESCRIPTION
PD16873/A/B/C is 3 aspect spindle motor driver that composed by CMOS control circuit and MOS bridge output.
The consumption electric power can be substantially reduced to the screwdriver which used a conventional Bipolar transistor by the adoption of 3 aspect all-wave PWM methods and making an output paragraph MOSFET.
FEATURES
* Low On resistance. (The summation of the on resistance of the upper and lower MOSFET) RON = 0.6 (TYP.) * Low consumption power for 3 aspects all-wave PWM drive method. * Index pulse (FG pulse) output function built in. * By the PWM-drive form and the IND pulse pattern, 4 kind, line-up
PWM method Pattern of IND pulse (at 12 pole motor) 3 phase composition output (18 pulses/turn) 1 phase output (6 pulses/turn) 1 phase output (6 pulses/turn) 3 phase composition output (18 pulses/turn)
PD16873 PD16873A PD16873B PD16873C
normal normal synchronous synchronous
* Built in STANDBY terminal and off the inner circuit at the time of the standby. * Built in START/STOP terminal. Operating short brake works, when ST/SP terminal is off state. * Supply voltage: 5 V drive * Low consumption current: IDD = 3 mA (MAX.) * Thermal shut down circuit (TSD) built in. * Over current protection circuit built in. (Setting by outside resistance) * Low voltage malfunction prevention circuit built in. * Reverse turn prevention circuit built in. * Hall bias switch built in. (synchronized STB signal.) * Loading into 30-pin plastic TSSOP (300 mil).
ORDERING INFORMATION
Part number Function normal-PWM/3 phase IND normal-PWM/1 phase IND 30-pin plastic TSSOP (7.62 mm (300)) synchronous-PWM/1 phase IND synchronous-PWM/3 phase IND Package
PD16873MC-6A4 PD16873AMC-6A4 PD16873BMC-6A4 PD16873CMC-6A4
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. S13870EJ1V0DS00 (1st edition) Date Published February 2000 N CP(K) Printed in Japan
(c)
2000
PD16873/A/B/C
ABSOLUTE MAXIMUM RATINGS (TA = 25C) When mounted on a glass epoxy board (10 cm x 10cm x 1mm, 15% copper foil)
Parameter Supply voltage Symbol VDD VM Input voltage Output pin voltage Output current (DC)
Note 1
Condition control block output block
Rating -0.5 to +5.7 -0.5 to +5.7 -0.5 to VDD + 0.5 -0.5 to +6.7
Unit V V V V A/phase A/phase A/phase W C C
VIN VOUT ID(DC) ID(pulse)
Note 3
DC PW < 5 ms, Duty < 30 % PW < 5 ms, Duty < 30 %
0.5 1.3 1.9 1.0 150 -55 to 150
Output current (pulse)
Note 2
Output current (pulse, reverse brake) Power consumption Peak junction temperature Storage temperature range
IDR(pulse) PT TCH(MAX) Tstg
Notes 1. DC 2. PW < 5 ms, Duty < 30 % (start-up, locking) 3. PW < 5 ms, Duty < 30 % (reverse brake)
RECOMMENDED OPERATING CONDITIONS When mounted on a glass epoxy board (10 cm x 10cm x 1mm, 15% copper foil)
Parameter Supply voltage Symbol VDD VM Input voltage Output current (DC)
Note 1
Condition control block output block
MIN. 4.5 4.5 0
TYP. 5.0 5.0
MAX. 5.5 5.5 VDD 0.4 1.0 1.5
Unit V V V A/phase A/phase A/phase mA mA C
VIN ID(DC) ID(pulse)
Note 3
DC PW < 5 ms, Duty < 30 % PW < 5 ms, Duty < 30 % 10 2.5 -20
Output current (pulse)
Note 2
Output current (pulse, reverse brake) Hall bias current IND terminal output current Operating temperature
IDR(pulse) IHB IFG TA
20 5.0 75
Notes 1. DC 2. PW < 5 ms, Duty < 30 % (start-up, locking) 3. PW < 5ms, Duty < 30 % (reverse brake)
2
Data Sheet S13870EJ1V0DS00
PD16873/A/B/C
CHARACTERISTICS (Unless otherwise specified, TA = 25C, VDD = VM = 5 V)
Parameter VDD pin current (operating) VDD pin current (standby) High level input voltage Low level input voltage Input pull-down resistance Triangle wave oscillation frequency Same aspect input range Hysteresis Input bias voltage Hall bias voltage IND terminal high level votlage IND terminal low level voltage Output on resistance (upper + lower MOSFET) Off state leakage Output turn-on time Output turn-off time Control standard input votlage range Control input voltage range Input current Input voltage difference Dead zone (+) Dead zone (-) Input offset voltage CL terminal voltage VIO VCL -15 90 100 15 110 mV mV ECR EC IIN ECR-EC EC_d+ EC_d- EC, ECR = 0.5 to 3.0 V Duty = 100%, ECR = 2 V exclusing dead zone ECR = 2 V ECR = 2 V 0 0 0.75 65 -65 100 -100 0.3 0.3 4.0 4.0 70 V V RON ID(OFF) tONH tOFFH ID = 200 mA -20C < TA < 75C -20C < TA < 75C RM = 5 star connection 0.6 0.9 10 1.0 1.0 VFG_H VFG_L IFG = -2.5 mA IFG = +2.5 mA 3.5 0.5 V V VHB IHB = 10 mA 0.3 0.5 V VHch VHhys IHbias VH = 2.5 V 1.5 15 4.0 50 1.0 V mV fPWM CT = 330pF 75 kHz VIH VIL RIND 110 1.8 VDD 0.8 V V k IDD IDD(ST) STB = VDD STB = GND 1.5 3.0 1.0 mA Symbol Condition MIN. TYP. MAX Unit
A
A
A s s
A
V mV mV
Thermal shut down circuit (TSD) works in TCH > 150C. Low voltage malfunction prevention circuit (UVLO) works in 4 V (TYP.).
Data Sheet S13870EJ1V0DS00
3
PD16873/A/B/C
PIN CONNECTION
IND STB VM VM OUT2 RF RF OUT1 VM VM OUT0 RF RF ISEN CL 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 EC ECR VDD CT H2+ H2- H1+ H1- H0+ H0- HB GND GND ST/SP NC
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
Pin name IND STB VM VM OUT2 RF RF OUT1 VM VM OUT0 RF RF ISENSE CL NC ST/SP GND GND HB H0- H0+ H1- H1+ H2- H2+ CT VDD ECR EC Index signal output terminal Standby mode input terminal
Terminal function
Supply voltage input terminal for motor part Supply voltage input terminal for motor part Motor connection terminal (W-phase) 3 pahse bridge common terminal 3 phase bridge common terminal Motor connection terminal (V-phase) Supply voltage input terminal for motor part Supply voltage input terminal for motor part Motor connection terminal (U-phase) 3 phase bridge common terminal 3 phase bridge common terminal Sense resistance connection terminal Over current detection voltage filter terminal No connection Start/Stop input terminal Ground terminal Ground terminal Hall bias terminal Hall signal input terminal (U-phase) Hall signal input terminal (U-phase) Hall signal input terminal (V-phase) Hall signal input terminal (V-phase) Hall signal input terminal (W-phase) Hall signal input terminal (W-phase) Oscillation frequency setting condenser connection terminal Supply voltage input terminal for control part Control standard voltage input terminal Control voltage input terminal
Caution Plural terminal (VM, RF, GND) is not only 1 terminal and connect all terminals.
4
Data Sheet S13870EJ1V0DS00
PD16873/A/B/C
BLOCK DIAGRAM
IND
1
30
EC
STB
2
29
ECR
VM
3 UVLO OSC
28
VDD
VM
4 Q5 T. S. D + Q6 Phase exciting pulse generation circuit Q3 CMP1 CMP2 -
27
CT
OUT2
5
26
H2+
RF
6
25
H2-
RF
7
+ -
24
H1+
OUT1
8 Q4
23
H1-
VM
9 CMP0 Q1
+ -
22
H0+
VM
10
21
H0-
OUT0
11 Q2
20
HB
RF
12
19
GND
RF
13 Reverse turn detection circuit
18
GND
ISEN
14
+ - 100 mV
17
ST/SP
CL
15
16
NC
Caution Plural terminal (VM, RF, GND) is not only 1 terminal and connect all terminals.
Data Sheet S13870EJ1V0DS00
5
PD16873/A/B/C
TYPICAL CHARACTERISTICS (TA = 25C)
PT vs. TA characteristics 2.0 TA = 25C 1.0
Power dissipation PT (W) VDD pin current (operating) IDD (mA) VDD pin current (standby) IDD (ST) ( A)
IDD, IDD (ST) vs. VDD characteristics
125C/W
IDD 1.0
0.5
IDD (ST) 0 -20 0 20 40 60 80 0 4.5 5.0 Control block supply voltage VDD (V) 5.5
Ambient temperature TA (C)
VIH, VIL vs. VDD characteristics (ST/SP, STB) 1.5 TA = 25C
High level input voltage VIH (V) LOW level input voltage VIL (V)
fPWM vs. VDD characteristics 100 TA = 25C CT = 330 pF
1.4 VIH, VIL
PWM frequency fPWM (kHz)
90
1.3
80
1.2
70
1.1
60
1.0 4.5
5.0 Control block supply voltage VDD (V) fPWM vs. TA characteristics
5.5
50 4.5
5.0 Control block supply voltage VDD (V) VHch vs. VDD characteristics
5.5
100
Hall amp. same aspect input range VHch (V)
VDD = 5 V CT = 330 pF
5.0
(+) (-)
TA = 25C
PWM frequency fPWM (kHz)
90
4.0
80
3.0
70
2.0
60
1.0
(+) (-) 5.0 Control block supply voltage VDD (V) 5.5
50 -20
0
20
40
60
80
0 4.5
Ambient temperature TA (C)
6
Data Sheet S13870EJ1V0DS00
PD16873/A/B/C
RON, vs. VM characteristics 1.0 TA = 25C
Output on resistance RON () Output on resistance RON ()
RON, vs. TA characteristics 1.0 VM = 5 V 0.8
0.8
0.6
0.6
0.4
0.4
0.2
0.2
0 4.5
5.0 Control block supply voltage VM (V)
5.5
0 -20
0
20
40
60
80
Ambient temperature TA (C)
(ECR-EC) vs. VDD characteristics 1.0 TA = 25C Duty = 100%
Dead zone EC_d+/EC_d- (mV)
EC_d+/EC_d- vs. VDD characteristics 100 TA = 25C 80 EC_d- 60 EC_d+ 40
Input voltage difference ECR-EC (V)
0.9
0.8
0.7
0.6
20
0.5 4.5
5.0 Control block supply voltage VDD (V) tONH, tOFFH vs. VM characteristics
5.5
0 4.5
5.0 Control block supply voltage VDD (V)
5.5
1.0
TA = 25C VDD = 5 V
Output turn-on time tONH ( s) Output turn-off time tOFFH ( s)
tONH
0.5
tOFFH 0 4.5
5.0 Control block supply voltage VDD (V)
5.5
Data Sheet S13870EJ1V0DS00
7
PD16873/A/B/C
FUNCTION OPERATION TABLE
(1) ST/SP (start/stop) function ON/OFF of the movement can be set up under the condition which makes oscillation circuit work. Setting is done with ST/SP terminal. When ST/SP terminal is high level, it becomes active (operating) condition. And, when ST/SP terminal is low level, it becomes stop condition. It becomes short brake condition under the stop condition. * ST/SP = "H"
Input signal (Hall amplifier output) Operation mode CMP 0 H H H H H H L L L L L L CMP 1 H H L L L L L L H H H H CMP 2 L L L L H H H H H H L L PWM H L H L H L H L H L H L ON OFF ON OFF ON OFF ON OFF ON OFF ON OFF UV UW VW VU WU WV exciting phase
In addition, the movement in OFF varies in the product. Loop is composed through parasitic diode of the high-side MOSFET. (PD16873/PD16873A) Loop is composed through channel of the high-side MOSFET. (PD16873B/PD16873C) * ST/SP = "L"
Input signal (Hall amplifier output) Operation mode CMP 0 - CMP 1 - CMP 2 - PWM - Stop (short brake)
It becomes short brake condition. (High side switch is "ON" and low side switch is "OFF")
8
Data Sheet S13870EJ1V0DS00
PD16873/A/B/C
(2) Torque order The relation between difference (ECR-EC) in control standard voltage (ECR) and control voltage (EC) and the torque is as follows.
Duty cycle Forward torque
100%
65 mVtyp 0.75 Vtyp
(-)
0.75 Vtyp 65 mVtyp
(+)
ECR-EC
100%
Reverse torque
Input voltage difference (ECR-EC) and output PWM duty becomes related to the proportion. In addition, it becomes reverse brake when input voltage is ECR < EC. It stops after the reverse rotation of the motor is detected under reverse braking mode. If input voltage difference is zero (ECR = EC), it becomes short brake mode.
Input voltage difference ECR > EC ECR = EC ECR < EC Output mode Forward turn Stop (short brake) Reverse turn
Note
Note After detecting reverse, it stops. (3) Standby mode By the setting of standby mode, the power supply inside PD16873 can be made off. Each output terminal at the time of standby mode becomes high impedance. Also, the oscillation block inside, too, stops and it is possible for the circuit current to reduce.
STB terminal "H" level "L" level Operation mode Regular mode Standby mode
Data Sheet S13870EJ1V0DS00
9
PD16873/A/B/C
TIMING CHART
(1) Hall signal input
H0
H1
H2
(2) CMP signal
CMP0
CMP1
CMP2
IND (873A/873B)
IND (873/873C)
(3) Output MOSFET drive and comparator choice
Q1 Q2 Q3 Q4 Q5 Q6 (SW) SW ON ON (SW) SW (SW) SW (SW) SW (SW) SW ON ON (SW) SW (SW) SW ON ON (SW) SW (SW) SW ON ON (SW) SW (SW) SW ON ON (SW) SW (SW) SW ON ON ON
Remark PD16873/A are not synchronous switching. (Normal type PWM)
PD16873B/C are synchronous switching of high-side MOSFET. (Synchronous type PWM)
10
Data Sheet S13870EJ1V0DS00
PD16873/A/B/C
(4) Output terminal voltage wave
OUT0
PWM
PWM
OUT1
PWM
PWM
OUT2
PWM
PWM
Caution (1) About output current The rated ouptut current differs depending on whether the motor revolves at a constant speed (steady state), is started (steady state), or Reverse brake is applied. The rated DC current when the motor revolves at a constant speed is 0.5 A, and the rated instantaneous current when the is started is 1.3 A. When the motor is stopped by using Reverse brake, the maximum current is 1.9 A. When use Reverse brake, a current exceeding that when the motor revolves at a constant speed (immediately before a brake is applied) instantaneously flows because of the counter electromotive force due to the motor inductance. Determine the value of over current for steady state, taking the peak current for using Reverse brake to the motor into consideration. (2) About output pin voltage Output terminal (OUT0, OUT1, OUT2) takes the voltage which exceeds a motor power supply during following counter current. Maximum rate of output pin voltage is 6.7 V. Be careful that an output terminal doesn't take a voltage over 6.7 V.
VM VM
ID ON OFF ON
ID
Q1 VOL
OFF: PD16873/A PWM ON: PD16873B/C
OUTA
OUTB VOUTB = IDR (ROUTB + RS) RON(N)
OUTA
OUTB VOUTB = VM + VOL RON(N)
OFF
PWM-ON
OFF
PWM-ON
RF ISEN RS
RF ISEN RS
Lower Nch MOC: PWM-ON time
Lower Nch MOC: PWM-OFF time
Data Sheet S13870EJ1V0DS00
11
12
IND STB VM
3 28 2 29 1 30
controller ECR VDD 330 pF
27
EC controoller
controoller
CPU
UVLO OSC CT H2+ HW
25 4
VM Q5 T. S. D
26
200
APPLICATION CIRCUIT EXAMPLE
MOTOR OUT2
5
Q6 RF
6
RF
7
Phase exciting pulse genration circuit H2- H1+ H1- H0+
22 21
+ -
+ Q3 -
23
24
HV
5 V 10%
into same aspect input range of hall amplifier.
OUT1
8
MOTOR Q4 VM
9
+ - Q1
HU H0- 200
20
Caution If hall elements connected series, please change hall bias resistances, and hall signal include
10
Data Sheet S13870EJ1V0DS00
VM OUT0
11
MOTOR Q2 RF
12
HB
19
RS RFIL 100 mV/RS RF
13
GND
18
GND
RFIL ISEN
14
1.8 k + - 100 mV 330 pF CL
15
RS
PD16873/A/B/C
CFIL
Reverse turn detection circuit
17
ST/SP
16
CPU NC
PD16873/A/B/C
PACKAGE DIMENSION
30-PIN PLASTIC TSSOP (7.62mm(300))
30 16 F G T detail of lead end
P L 1 15 U E
A A' S
H I J
C D M
M
N B K
S
NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition.
ITEM A A' B C D E F G H I J K L M N P T U
MILLIMETERS 9.850.10 9.70.1 0.375 0.65 (T.P.) 0.240.05 0.10.05 1.2 MAX. 1.00.05 8.10.1 6.10.1 1.00.1 0.1450.025 0.5 0.10 0.10 3 +5 -3 0.25 0.60.15 S30MC-65-6A4
Data Sheet S13870EJ1V0DS00
13
PD16873/A/B/C
RECOMMENDED SOLDERING CONDITIONS
Solder this product under the following recommended conditions. For soldering methods and conditions other than those recommended, consult NEC. For details of the recommended soldering conditions, refer to information document "Semiconductor Device Mounting Technology Manual".
Recommended Condition Symbol IR35-00-3
Soldering Method Infrared reflow
Soldering Conditions Package peak temperature: 235C; Time: 30 secs. max. (210C min.); Number of times: 3 times max.; Number of day: none; Flux: Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% max.) is recommended. Package peak temperature: 215C; Time: 40 secs. max.; (200C min.) Number of times: 3 times max.; Number of day: none; Flux: Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% max.) is recommended. Package peak temperature: 260C; Time: 10 secs. max.; Preheating temperature: 120C max.; Number of times: once; Flux: Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% max.) is recommended.
VPS
VP15-00-3
Wave Soldering
WS60-00-1
Caution Do not use two or more soldering methods in combination.
14
Data Sheet S13870EJ1V0DS00
PD16873/A/B/C
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
Data Sheet S13870EJ1V0DS00
15
PD16873/A/B/C
* The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98. 8

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